Also know as thermal plates, hot plates, cold plates, hot/cold plates, platens etc., our Thermal Platforms’ are often used to conductively heat & cool electronic components under test, however, our thermal platforms’ precision temperature control and high heat removal rates lend themselves to very effective temperature control from very low to quite hot for any process that can be conductively fit on their platen.
Our T-Series cryogenically cooled, or “expendable refrigerant” thermal platforms use LN2 or LCO2 , while our Mechanically Refrigerated Thermal Platforms (MRTPs) use a closed loop, vapor compression refrigeration system for cooling, so they require no LN2 or LCO2. ESS Thermal Platforms perform the task of heating or cooling and maintaining temperature very quickly and precisely over a very wide temperature range with very high heat removal capacities.